Fastmicro

Wafer Surface Particle & Defect Inspection System

Name: Wafer Surface Particle & Defect Inspection System
Brand: Fastmicro

High-throughput direct surface particle and defect inspection for 4/6/8/12-inch wafers

Suitable for incoming wafer inspection, in-process monitoring, post-cleaning verification, and defect location analysis. The system provides particle count, size, and position data for process, quality, and equipment teams, enabling faster identification of contamination risks and supporting downstream analysis workflows.

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Wafer Surface Particle & Defect Inspection System

Product Overview Typical Applications Customer Stories Product Parameters Download Center Related Products

PRODUCT OVERVIEW

Product Overview

Applicable Targets

4/6/8/12-inch wafers
Silicon, GaN, compound semiconductor, and glass substrates
Wafer front side, back side, edge, and bare wafers

Typical Applications

Incoming inspection
In-process monitoring
Post-cleaning verification
Post-maintenance particle check
Rapid defect location prior to microscopy/SEM analysis

Product Introduction

A high-throughput direct detection process helps customers obtain data on the count, size, and location of particles on wafer surfaces more quickly.

Product Introduction

A high-throughput direct detection process helps customers obtain data on the count, size, and location of particles on wafer surfaces more quickly.

Product Introduction

A high-throughput direct detection process helps customers obtain data on the count, size, and location of particles on wafer surfaces more quickly.

Product Introduction

A high-throughput direct detection process helps customers obtain data on the count, size, and location of particles on wafer surfaces more quickly.

TYPICAL APPLICATION

Typical Applications

Wafer surface particle inspection application

Various equipment configuration overview

CUSTOMER STORY

Customer Stories

Dr. Ir. L.H.A. Leunissen | ASML, cleanliness project manager remarked: "As a long-term partner, Fastmicro's integrated application has enabled us to meet equipment defect rate targets. The system not only delivers precise measurements but is also characterized by ease of operation and high throughput. We highly recognize Fastmicro's professional service and look forward to further expanding the system's functional boundaries through deeper collaboration."

PRODUCT PARAMETER

Product Parameters

General Specifications
Detection Range	From 0.1 µm PSL equivalent particles
Throughput	Up to 400 wafers/hour
Position Accuracy	40 µm
Position Repeatability	15 µm
Supported Wafer Sizes	4 - 12 inch
Detection Capability	Supports front and back side wafer inspection applications

DOWNLOAD CENTER

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Wafer Surface Particle Rapid Detection System (PDS)

Rapid particle detection system for wafer surface contamination monitoring in semiconductor fabs.

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Wafer Surface Particle & Defect Inspection System